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[Electronic Design TOC Newsletter]

November 17, 2008



Staff  |   ED Online ID #20246  |   November 17, 2008

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ED_Electronic Design TOC_: PACs Become Task Masters

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The future of embedded apps. Unlocked by Intel's newest designs.

A new world of innovative, potentially life-changing embedded applications is right around the corner. Only with Intel's faster, cooler, smaller designs. Check out the possibilities.



FEATURES


Engineering Feature · By Terry Costlow, Contributing Editor

PACs Become Task Masters


Faster speeds and greater memory make it easier to integrate many functions in one system using programmable automation controllers.

Technology Report · By Mat Dirjish, Components/Interconnects/Packaging Editor

Ultracapacitors Branch Out Into Wider Markets


Known for their muscle, these devices are scaling back in size but not in power to provide juice for a broader range of devices—including portables.

Engineering Essentials · By Don Tuite, Analog/Power Editor

Challenges Lie Ahead At The Physical Layer


High-speed serial data has all but replaced parallel buses, but it's getting tougher to ramp up the throughput.

Design Solution · By Paul Franklin, LXI Consortium

Get Started On Your LXI-Compliant Instrument Design


Whether the device falls into Class A, B, or C compliancy, a number of decisions must be made before the design process begins.

Intel
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IDEAS for DESIGN


By Tom Bruhns, Agilent Technologies Inc.

Using Copper Traces As Ballast Resistors Ensures Balance



By Shyam Sunder Tiwari, Sensors Technology Private Ltd.

Superior JFET Biasing Improves Amplifier Performance



By Dennis Myer, Nova Scotia Community College

Rotating LED Array Emulates Marquee-Type Display



TECHVIEW


Leapfrog · By Don Tuite, Analog/Power Editor

Stack Monitor Chips Without Isolation Concerns To Give Your Electric Car Some Zip



EDA · By David Maliniak, EDA Editor

Custom Sources Light Way To 22-nm IC Lithography



Analog & Power · By Don Tuite, Analog/Power Editor

Fast ADC Sips Power, Simplifies Design-In



EEPN in ELECTRONIC DESIGN


From The Editor · By Mat Dirjish, Packaging/Optoelectronics Editor

Hairy Gecko Peds Hold Key To Powerful Dry Adhesives



From The Industry · By Stephen J. Whitney, Littelfuse Inc.

Select The Right Circuit Protection For Switch-Mode Power Supplies



COLUMNS


Editorial · By Joe Desposito, Editor-in-Chief

The Very Old And Very New Converge At Belgium’s IMEC



Point Of View · By Joe Shapiro, National Instruments

Are Designers Making Multicore More Complicated? Or Less?



Point Of View · By Joe Shapiro, National Instruments

PACs Address Increasing Green Monitoring Requirements



Pease Porridge · By Bob Pease

Bob's Mailbox





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  • A New Design Inflection Point
  • Forecasting Industry Growth For 2009 And Beyond
  • EDA Retools To Exploit Multicore Architectures
  • Design And Verification Move Up In Abstraction
  • EDA Retools To Exploit Multicore Architectures
  • A New Design Inflection Point
  • Design And Verification Move Up In Abstraction
  • Challenges Lurk For 22-nm Physical Implementation
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