Richard Gawel
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ED Online ID #17534 |
October 31, 2007
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Electronic Design UPDATE e-Newsletter | October 31, 2007
Increase Test Throughput With Multicore Technology And NI LabVIEW 8.5
Designed specifically for engineers and scientists, National Instruments LabVIEW software is multithreaded and inherently parallel, with built-in connectivity to I/O, extensive analysis functions, and advanced display and plotting capabilities. Automatically benefit from advances in multicore processor technology with the power of LabVIEW graphical programming.
Electronic Design UPDATE edited by Richard Gawel, Managing Editor
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Come check out the Hotspots added to our Home Page, filled with all the latest EDA, analog, embedded, and power content from the ED editors.
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industry view |
The m2m Market Gets Ready To Explode By Roger Dewey, President & CEO Telit Wireless Solutions Inc.
Machine-to-machine (m2m) communications technologies have been around for many years and stuck at the bottom of the growth curve. But their fortunes are about to change. As cellular-based mobile solutions meet the rapidly growing data connection needs for greater speed, cost savings, and accuracy, the growth potential of key m2m markets will rapidly grow as well...
Practical Ways To Estimate, Implement, And Verify SoC Decoupling Capacitance By John Pedicone and David Stringfellow Synopsys Consultant Services
Deep-submicron systems-on-a-chip (SoCs) require a power-grid voltage drop of much less than 10% of VDD. Decoupling capacitors, or decaps, help achieve this goal by minimizing switching noise. Determining the amount of decap required for an SoC involves many considerations, but the task needn't be a chore...
Big And Fast Flash Storage Goes To The Head Of The Enterprise Class
The RamSan-500 is the first enterprise-class cached flash storage system and the fastest flash-based solid-state device currently available, according to Texas Memory Systems. Compared to a high-end hard-disk-based redundant array of inexpensive disks (RAID) system of similar capacity, the RamSam-500 can deliver more than 16 times the performance while using 50% less power...
Thermal Engineering Report: Dissipating Heat in Electronic Devices to Improve Reliability
Failures on rushed, high-profile projects are often the catalyst for companies to investigate next-generation Computer-Aided-Engineering solutions. This report delves into the common mistakes companies designing consumer and commercial electronics have made and offers recommendations to help your company unlock the power of these technologies in the early stages of product development.
The Segway personal transport system has inspired designers to use gyroscopes and accelerometers to monitor the angular positions of freestanding robots. Students across the country also have used the Segway as a model for their robotic projects.
IBM has come up with a cleaner way to reuse scrap silicon leftover from the chipmaking process. Its new method of scrubbing Intellectual Property (IP) off semiconductor wafers allows them to be reused or resold to solar panel manufacturers.
Intel's latest Core2 processors, codenamed Penryn and manufactured on Intel's 45-nm process, are now in the labs at Chipworks and ready to undergo thorough structural analysis and transistor characterization.
Freescale Semiconductor has announced its Global Design Challenge, which invites embedded designers and engineering students to create environmentally friendly designs using a select group of the company's products and compete for a $50,000 prize.
Power Electronics Technology Exhibition & Conference
More technical Content. More exhibits. More teardowns. More of what you need to know to find the right technologies, products and components to integrate into an ever-evolving array of complex applications. From Oct. 30 to Nov. 1, the Power Electronics Technology Exhibition & Conference, held in the Hilton Anatole hotel in Dallas, Texas, will give you the tools to optimize every element of the design process:
An educational program focuses on practical, day-to-day solutions;
A full contingent of suppliers demonstrating their latest innovations in the Exhibit Hall;
And a conference schedule that hits all of the high notes - digital and portable power, power design, conversion and management, magnetics, alternative energy, LED drivers and more.
Design a product that improves, benefits or protects the environment using one or more select Freescale products. If your design wins, you win $60,000, a private booth in the Technology Lab at the Freescale Technology Forum in Orlando and an all-expenses-paid trip to present your design to your global peers at the FTF of your choice.
Vote For This Year's Top Stories And Win A T-Shirt
Which Leapfrog and Idea For Design are number one? You be the judge. The ED editors have compiled a list of this year's top 10 most-viewed Leapfrogs and Ideas For Design articles from our publication. Now all that is left is to determine which are number one. On December 3, Electronic Design will launch its third annual Best Electronic Design issue, in which two champion articles will be presented as your favorites. So if you have a particular article that you've held on to throughout the year, or want to see what your fellow EEs are reading the most, click on the link and take a look at this year's best of the best. As a special thank you, we will be doing a random drawing of participants, giving away Electronic Design T-shirts to 10 winners.
Wireless Networking: Know It All By Praphul Chandra, Daniel M. Dobkin, Alan Bensky, Ron Olexa, David A. Lide, and Farid Dowla
There are dozens of books on wireless networking out there. And just when the authors finish the book, it becomes obsolete as new standards, technologies, chips, and applications come along. Yet this book is more up to date than most.
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