Two embedded computer module vendors, MSC Vertriebs GmbH and Hectronic, have joined the Qseven consortium, throwing their support to the new small form factor. Targeting next-generation embedded processors built using 45-nm technology, the Qseven platform will offer high-performance computing power on a board measuring 70 by 70 mm. The consortium plans to release a general specification and a design guide by the end of Q2 2008.
The specification will permit various processor configurations and allow a maximum dissipation of about 12 W. Typical applications will include automation/DIN rail systems, automotive, and any other application where an ultra-mobile embedded computing system is needed. For applications where heat is a concern, the spec defines a thermal cooling interface to help transfer any heat generated to a cooling solution.
Compared to other small form-factor approaches, Qseven features an onboard graphics controller with output options for 2x 24-bit LVDS, SDVO, DisplayPort, and HDMI. It also supports the new VESA DisplayID standard to automatically detect the attached flat-panel display. By leveraging the Mobile PCI Express Module (MXM) connect format, Qseven offers two connector heights, 5.5 mm and 7.8 mm.
MSC Vertriebs GmbH
www.msc-ge.com
Hectronic
www.hectronic.se
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