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[Electronic Design TOC Newsletter]

April 24, 2008



Staff  |   ED Online ID #18959  |   April 24, 2008

Article Rating: Not Rated

ED_Electronic Design TOC_: Radio Interoperability—It's Harder Than It Looks

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FEATURES


Engineering Feature · By Don Tuite, Analog/Power Editor

Radio Interoperability—It's Harder Than It Looks


Emergency management can be difficult. Designing the systems that provide seamless communication between personnel presents some equally tough challenges.

Technology Report · By David Maliniak, EDA Editor

Software Rules The Day In Multicore SoC Design


With the number of on-chip processors set to explode, software-development issues loom for design teams. Yet D&V methodologies may evolve to avert any stumbling over parallelism.

Engineering Essentials · By Danial Harris, Digital Technology Editor

Storage Must Prepare For The Zettabyte Universe


All guts and no glory—storage solutions in the Information Age aren’t the engineering “no-brainers” they once were.


DEPARTMENTS


Lab Bench · By Bill Wong, Embedded/Systems/Software Editor

A Visionary Passes, But The Dream Survives



Design Solution · By Danny Tseng, Cypress Semiconductor

Bridge Architecture Solves Performance, Design, Cost Problems In New Portables



Ideas For Design · By Leo Sahlsten, Maxim Integrated Products

Circuit Transfers Resistance Value Through Isolation Barrier



Ideas For Design · By Kartik Joshi, Netaji Subhas Institute of Technology

Novel Switch Interface Scheme Reduces Microprocessor Pin Count



Ideas For Design · By Abhijeet Deshpande

Electronic Birthday Candles “Blow Out” One At A Time



EEPN In Electronic Design · By Mat Dirjish, Packaging/Optoelectronics Editor

Unique Technology Boosts Image Quality Of Low-Cost Cameras



EEPN In Electronic Design · By Hal Phillipp, Quantum Research Group Ltd.

Please Touch! Explore The Evolving World Of Touchscreen Technology



TECHVIEW


Leapfrog · By Daniel Harris, Digital Editor

SDRAM Chip Set Boldly Goes Where No Man Has Gone Before



Analog & Power · By Don Tuite, Analog/Power Editor

Single Chip Digitizes High-Side Power Measurements



EDA · By David Maliniak, EDA Editor

Design Flow Halves Development Time For Mixed-Technology PCBs



Communications · By Louis E. Frenzel, Communications/Test Editor

Superior Dispersion Compensation Paves The Way For 40- And 100-Gbit/s Fiber Transmission



COLUMNS


Editorial · By Joe Desposito, Editor-In-Chief

Turning Buses And Trucks Into Hybrid Vehicles



Point Of View · By Carla Feldman, Agilent Technologies

High-Speed Serial Data And RF Wireless Dominate Today's T&M



Pease Porridge · By Bob Pease

Bob's Mailbox





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