Semiconductor makers STMicroelectronics and Infineon have teamed with 3D packaging provider STATS ChipPAC to jointly develop the next generation of embedded Wafer-Level Ball Grid Array (eWLB) technology. The technology will be based on Infineon’s existing eWLB packaging, which has been licensed to both STMicroelectronics and STATS ChipPAC.
The new R&D effort will focus on using both sides of a reconstituted wafer to facilitate building semiconductor devices with a higher integration level and a greater number of contact elements. The resulting IP will be owned by all three companies.
eWLB technology combines traditional front- and back-end semiconductor manufacturing techniques with parallel processing of all the chips on the wafer. Together with an increased level of integration of the silicon’s overall protective package and higher number of external contacts, the eWLB technology can provide significant cost and size benefits for makers of cutting-edge wireless and consumer products.
STMicroelectronics plans to use the technology in several products in wireless and other application markets, with first samples expected by the end of 2008 and production capability by early 2010.
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