Technology In The News

614 results found for Technology In The News, displaying items 1 - 20

 



July 24, 2008
LabVIEW-Based Systems Monitor Health Of Chinese Megastructures
The China Earthquake Administration has selected a structural health monitoring (SHM) system from CGM Engineering Inc. to help engineers conduct research on seven recently constructed megastructures. CGM, a National Instruments Alliance Partner, based the system on the NI LabVIEW graphical system design platform and NI CompactRIO programmable automation controllers.  — ED News Staff

July 23, 2008
CE Companies Creating Enhanced WHDI Standard
Several consumer electronics companies have joined together to form a special interest group to develop an industry standard for multi-room audio, video, and control connectivity using Wireless Home Digital Interface (WHDI) technology. Amimon Inc., Hitachi Ltd, Motorola Inc., Samsung Electronics Co. Ltd, Sharp Corp., and Sony Corp. intend to have the new standard completed this year.  — ED News Staff

July 23, 2008
WiMAX MIMO Device Uses SkyCross Antenna Technology
The first USB device certified by the WiMAX Forum, the MiMAX Q-Series USB dongle from Airspan Networks Inc., incorporates the SkyCross Isolated Mode Antenna Technology (iMAT). Introduced by SkyCross in late January, iMAT allowed the MiMAX to be certified for the 2.5-GHz band, operating at nearly every applicable WiMAX and Wi-Fi frequency from 2 GHz to 5 GHz.  — ED News Staff

July 23, 2008
Mitel Picks Octasic For Echo Cancellation
Mitel has chosen Octasic Inc.’s media processing technology to provide echo cancellation for the Mitel 5000 Network Communications Solution and the Axxess Converged Communication System. The Axxess product line uses open architecture interfaces and standard protocols to transparently combine IP, wireless, digital, and analog into a single platform to unify communications into one interoperable enterprise.  — ED News Staff

July 22, 2008
TI Announces 2009 Roadmap For Low-Power Processors
Texas Instruments has revealed a low-power processor roadmap for 2009 that includes more than 15 new multi-architecture devices across four product lines. A breakthrough, the company says, will be the industry’s lowest power floating-point DSPs, the TMS320C674x family. For the first time, designers will be able to bring portability to applications requiring the high-precision and fast time-to-market provided by floating-point processors.  — ED News Staff

July 21, 2008
Infineon Power Electronics Run Chinese Hybrids
Chinese automobile manufacturer ChangAn Inc. has equipped a number of its vehicles in the Jiexun series with a mild-hybrid engine, using Infineon Technologies’ power electronics. The hybrid electric vehicles (HEVs) will be used as taxis for athletes and spectators during the Olympic Games in Beijing.  — ED News Staff

July 21, 2008
UC San Diego Installs Highest Resolution Scientific Display
The California Institute of Telecommunications and Information Technology (Calit2) has unveiled what is says is the highest resolution display system for scientific visualization in the world at the University of California, San Diego. The system targets to the need for scientists to explore vast amounts of data visually and collaboratively in ultra-high resolution environments.  — ED News Staff

July 21, 2008
SMPTE Will Define Standard For Home 3D
The Society of Motion Picture and Television Engineers (SMPTE) is establishing a task force to define the parameters of a stereoscopic 3D mastering standard for content viewed in the home. The 3D Home Display Formats Task Force will hold its first meeting on Aug. 19, hosted by the Entertainment Technology Center at the University of Southern California.  — ED News Staff

July 17, 2008
iPhone Adds 3G Functionality, Drops Cost
iSuppli – After a teardown of the iPhone 3G, iSuppli Corp. confirmed a significant drop in bill of material (BOM) costs, indicating a cheaper end product than last year’s 2G iPhone. At $174.33, the BOM and manufacturing cost of the new iPhone is markedly less than the $227 that iSuppli estimated for the first-generation, 8 Gbyte 2G version in June 2007. This strip down results in about $100 less for consumers, totaling $499 for the iPhone 3G, whereas last year’s model called for $599.  — ED News Staff

July 16, 2008
Energy Harvesting Products, Micro Fuel Cells Poised For Success
At the Semicon West convention held earlier this month, several representatives from Darnell Group held a panel discussion on the energy harvesting and its forthcoming mass appeal. Speakers included Jeff Shepard, president of Darnell, Jerry ruddle, executive vice president with Advanced Cerametrics and Solicore’s vice president, Jarreth Solomon.  — ED News Staff

July 15, 2008
iPhone Drops The BOM
How does Apple improve on cutting-edge technology? Check out the 3G iPhone's bill of materials (BOM), released by iSuppli.  — ED News Staff

July 15, 2008
Checklist Helps Pick Analog/M-S, RF Foundry
The Global Semiconductor Alliance’s Analog/Mixed-Signal/Radio Frequency (AMS/RF) Process Checklist Version 1.0 aims to make it easier for semiconductor companies to obtain information on an AMS/RF foundry process. It specifically targets the information need to evaluate a foundry’s AMS/RF process and determine if it addresses all of the company’s needs.  — ED News Staff

July 14, 2008
China TV To Use On2 Platform For Olympic Video
China’s nationwide broadcasting network, CCTV, will use the On2 Flix Engine to encode and publish video coverage of the Beijing Olympics on its domestic Web site at www.cctv.com, according to On2 Technologies, Inc.  — ED News Staff

July 10, 2008
MIT Demonstrates 25-nm Lithography
MIT researchers have used a recently developed technique called scanning-beam interference lithography (SBIL) to achieve a significant advance in nanoscale lithography. The team created line about 25-nm wide separated by 25-nm spaces. By comparison, the most advanced commercially available computer chips today have a minimum feature size of 65 nm.  — ED News Staff

July 9, 2008
COM Spec For Mobile/Ultra-Mobile Use Is Ready
The Qseven Consortium has released version 1.0 of the Qseven specification, which unlike previous computer-on-module (COM) standards, focuses primarily on mobile and ultra-mobile applications. The specification defines fast serial differential interfaces such as PCI Express and Serial ATA, but omits support for legacy interfaces like EIDE and PCI in order to provide ideal support for today as well as future CPU’s and chipsets.  — ED News Staff

July 9, 2008
Desktop Monitor Market Will Grow Through 2015
DisplaySearch has revised its forecast for desktop monitors through 2015 in the company’s latest Quarterly Desktop Monitor Shipment and Forecast Report. The in-depth analysis of longer term trends indicates that the desktop monitor market is poised for growth throughout the forecast period.  — ED News Staff

July 1, 2008
Sun-Based Distiller Wins Green Design Contest
The Digital Sun Distiller, a device that allows a person to purify and reuse household water, has won America’s division of Freescale Semiconductor’s first green FTF Design Challenge. The distiller was developed by Jose Luis Rojas of iluxon S.A. de C.V. of San Luis Potosi, Mexico. Rojas will receive $10,000 and an invitation to compete in the Grand FTF Challenge with other first place global winners for $50,000.  — ED News Staff

July 1, 2008
National’s Technology Hikes Solar Array Efficiency
Jumping into the photovoltaic market, National Semiconductor Corp. has created a new technology designed to increase the overall energy output of solar power systems under adverse conditions. The SolarMagic technology extracts the maximum power efficiency from each photovoltaic panel, even when some panels in the array are compromised by shading, debris, or inherent panel-to-panel mismatching.  — ED News Staff

June 30, 2008
Plextronics Works With USDC To Boost OLED Performance
Plextronics has completed a $590,000 project with the U.S. Display Consortium (USDC) to enable broad commercialization of high-performance, low-cost, organic light-emitting diode (OLED) displays. The project involved development of a new hole injection layer (HIL) technology that is expected to reduce surface  — ED News Staff

June 25, 2008
Solar Cell Investments Will Climb To Semiconductor Levels By 2010
By 2010, a booming demand for solar energy will increase worldwide investments in the production of Photovoltaic (PV) cells to the same level as those for semiconductor manufacturing, according to iSuppli. The market research group predicts global production of PV cells will rise to as much as 12 GW by 2010, up from 3.5 GW in 2007.  — ED News Staff





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