594 results found for Interconnections /Packaging, displaying items 1 - 20
September 5, 2008
[Web Exclusive] Chip Companies Team Up On Tech Deals
Joint ventures and technology deals have been the theme for some of Europe’s biggest chip makers this Olympic summer, with Munich-based Infineon taking the gold medal and STMicroelectronics (ST) coming in a close second with silver. ULIS and Renesas Technology Europe also placed well, with their own advances in sensors and power MOSFETs, respectively.
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Paul Whytock
September 2, 2008
[Web Exclusive] Engineering A Hall Of Famer
Once a year we at Electronic Design ask our readers to stand up and recognize those who have made major contributions to the electronic engineering world. Our “2008 Electronic Design Hall of Fame” is primed to hoist another class of engineer superheroes onto your proverbial shoulders.
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John Arkontaky
August 12, 2008
[ED Bookstore] Lessons Learned From A Lean Consultant
Want some insights into “lean” manufacturing? Want to learn from the mistakes made when companies failed in their quest for more efficient manufacturing? Then this is the right book to read.
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Roger Allan
July 24, 2008[EEPN In Electronic Design] Early Warning Is In The Air For Effective Thermal Management
For today’s makers of high-reliability equipment, increased performance requirements have meant packing more and more hardware onto boards and stuffing higher-density boards into shrinking chassis. As a result, the power density (power dissipated per unit area) of electronic products, measured by the ability to dissipate heat, has skyrocketed, increasing by a factor of 20 to 50 in the last few decades. More and more, hot new products mean hotter chips and...
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Rajesh Nair
July 24, 2008[Technology Report] MEMS And 3D Packaging
As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To suppress costs and make them more competitive in the market, they need high-density packaging. MEMS devices are essentially “machines” that involve motion, not transistors. This means they must be effectively protected from the environments they operate in, which often can be very...
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Roger Allan
July 24, 2008[Technology Report] Shrinking ICs Need High Density In A Package Deal
The push is on for IC packages in smaller form factors, not only length- and width-wise, but also height-wise. Hence, the term “3D ICs.” Smaller form factors require greater density, and that means stacking chips and boards on top of each other in a 3D form. As ICs downsize from quad flat packs (QFPs) to ball-grid arrays (BGAs) and further down the line, fewer stacks and external I/Os are needed (Fig....
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Roger Allan
July 17, 2008
[Technology In The News] iPhone Adds 3G Functionality, Drops Cost
iSuppli – After a teardown of the iPhone 3G, iSuppli Corp. confirmed a significant drop in bill of material (BOM) costs, indicating a cheaper end product than last year’s 2G iPhone. At $174.33, the BOM and manufacturing cost of the new iPhone is markedly less than the $227 that iSuppli estimated for the first-generation, 8 Gbyte 2G version in June 2007. This strip down results in about $100 less for consumers, totaling $499 for the iPhone 3G, whereas last year’s model called for $599.
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ED News Staff
July 9, 2008
[Technology In The News] COM Spec For Mobile/Ultra-Mobile Use Is Ready
The Qseven Consortium has released version 1.0 of the Qseven specification, which unlike previous computer-on-module (COM) standards, focuses primarily on mobile and ultra-mobile applications. The specification defines fast serial differential interfaces such as PCI Express and Serial ATA, but omits support for legacy interfaces like EIDE and PCI in order to provide ideal support for today as well as future CPU’s and chipsets.
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ED News Staff
June 23, 2008
[Technology In The News] Twisted Bonding Technology Speeds Up CMOS Devices
Improved bonding technology helped Toshiba and IBM Corp. develop a higher performance CMOS FET. CMOS has traditionally played a central role in semiconductor design, a position now under threat as scaling approaches physical limits that inhibit further advances in transistor performance and migration to finer process technology.
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ED News Staff
June 19, 2008[Technology Report] In Search Of The Next Disruptive Technology
Megatrends donâ??t simply happen on their own. They start with disruptive technologies that completely change the status quo, like gunpowder, the airplane, and the microprocessor. The trick lies in identifying potential disruptive technologies early on and then predicting where they might lead. Back in 1976, I was part of a group at Tektronix tasked with retraining oscilloscope sales and field engineers to sell microprocessor development...
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Don Tuite
May 15, 2008
[Web Exclusive] Green Chemistry Initiative Has Critics Seeing Red
California is preparing the nation’s toughest standards for chemical use with its Green Chemistry Initiative (GCI), which was launched about a year ago. And if you thought the European Union’s Restrictions on Hazardous Substances (RoHS) were tough, you ain’t seen nothing until you meet a bill signed into law last October by California Governor Arnold Schwarzenegger.
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Daniel Harris
May 12, 2008
[Technology In The News] IEEE Honors Developers Of Flip-Chip Technology
Karl J. Puttlitz Sr. and Paul A. Totta have won the 2008 IEEE Components, Packaging and Manufacturing Technology Award. They are being recognized for their pioneering role in the establishment of flip-chip interconnection technology, which has helped drive the miniaturization and improve the performance and durability of electronic devices such as personal computers and mobile phones.
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ED News Staff
April 2, 2008
[Technology In The News] Multicore Association Completes API Spec
The Multicore Association has completed version 1.0 of its multicore communications application programming interface (MCAPI) and will soon make it publicly available. The association, an industry consortium focused on developing standards that speed time to market for systems using multicore processors, has been working on MCAPI for two years.
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ED News Staff
March 27, 2008
[Technology In The News] Amphenol Launches Backplane Design Portal
The newly launched DesignLink Web portal from Amphenol TCS delivers a custom suite of proprietary engineering design tools and technical information specific to high-speed backplane design. The secure Internet portal features a set of unique, interactive tools that allows designers to perform tradeoff analyses at any phase of a backplane design cycle.
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ED News Staff
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